涂锡焊带的技术参数
1、 铜基:无氧铜 铜含量≥99.97%
2、 铜基电阻率:无氧铜≤0.01724 Ωmm2/m
3、 焊锡熔点:179-224℃
4、 涂层厚度:0.01~0.05mm 可按客户要求定制,双面涂层均匀一致
5、 焊带硬度及伸长率:
铜带硬度: HV45~50 ; 延伸率:软态≥15%超软态≥25%
6、宽度误差:±0.03mm ; 厚度误差:±0.005mm
涂锡焊带的分类
按涂层成分分类:⑴63%Sn 37%Pb
⑵60%Sn 40%Pb
⑶96.5%Sn 3.5%Ag
⑷99%Sn 1% Ag
⑸62%Sn 36%Pb 2% Ag
涂锡焊带的规格
(电阻率<2.0×10-6Ω·m;延伸率≥25%;抗拉强度≥70N)
(焊带的规格可根据用户实际需求生产提供) 单位Unit: mm
产品名称
Products
|
规格(宽度*厚度)
specification
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锡层厚度
Tin thickness
(one-side)
|
宽度误差
Width error
|
厚度误差
Thickness error
|
互联条
Connection
|
1.5×0.15
|
0.025
|
±0.03
|
±0.005
|
1.5×0.18
|
0.025
|
±0.03
|
±0.005
|
1.6×0.15
|
0.025
|
±0.03
|
±0.005
|
1.6×0.18
|
0.025
|
±0.03
|
±0.005
|
1.6×0.20
|
0.025
|
±0.03
|
±0.005
|
1.8×0.15
|
0.025
|
±0.03
|
±0.005
|
1.8×0.16
|
0.025
|
±0.03
|
±0.005
|
1.8×0.18
|
0.025
|
±0.03
|
±0.005
|
1.8×0.20
|
0.025
|
±0.03
|
±0.005
|
2.0×0.15
|
0.025
|
±0.03
|
±0.005
|
2.0×0.18
|
0.025
|
±0.03
|
±0.005
|
2.0×0.20
|
0.025
|
±0.03
|
±0.005
|
2.5×0.15
|
0.025
|
±0.03
|
±0.005
|
2.5×0.18
|
0.025
|
±0.03
|
±0.005
|
1.5×0.20
|
0.025
|
±0.03
|
±0.005
|
汇流带
Busbar
|
4.0×0.15
|
0.025
|
±0.03
|
±0.005
|
4.0×0.20
|
0.025
|
±0.03
|
±0.005
|
5.0×0.15
|
0.025
|
±0.03
|
±0.005
|
5.0×0.20
|
0.025
|
±0.03
|
±0.005
|
5.0×0.25
|
0.025
|
±0.03
|
±0.005
|
5.0×0.30
|
0.025
|
±0.03
|
±0.005
|
5.0×0.35
|
0.025
|
±0.03
|
±0.005
|
6.0×0.20
|
0.025
|
±0.03
|
±0.005
|
6.0×0.25
|
0.025
|
±0.03
|
±0.005
|
6.0×0.30
|
0.025
|
±0.03
|
±0.005
|